Visualization solution for the interior of molds in semiconductor resin encapsulation.
We propose improvements to the quality and production efficiency of package molding, where issues become apparent!
There is a trend in the automotive semiconductor industry, particularly in power semiconductors, to quantify the internal conditions of molds, which can be considered a black box, during the resin encapsulation process. This trend is driven by the emergence of issues related to moldability due to the miniaturization and thinning of semiconductor packages and the fine pitch. As a countermeasure, there is a growing need to improve productivity and quality through actual measurements of resin filling pressure and temperature within the mold cavity during package molding. In response to this need, Kistler proposes a "visualization solution for the interior of the mold" using high-performance quartz piezoelectric in-mold pressure sensors to measure resin filling pressure and temperature.
- Company:Kistler Japan G.K. Head office
- Price:Other